Suntai's high-temperature solder paste are used for high-reliability, compatibility and sustainability applications, such as soldering and die-attach. In various industries including aerospace, automotive, RF infrastructure, military, laser and medical products.

Providing an alternative to traditional high-lead options. Suntai offers is continuously developing novel lead-free solutions. The high-temperature lead-free solder paste has the advantages of fine solderability and wettability, high solder joint strength, high reliability, solderability in air and nitrogen protection.

Suntai's high-lead solder paste are used for high-reliability, compatibility and sustainability applications, such as soldering and die-attach. In various industries including aerospace, automotive, RF infrastructure, military, laser and medical products.

Providing an alternative to traditional high-temperature options, Suntai offers and is continuously developing novel high-lead solutions. The high-lead solder paste has the advantages of fine solderability and wettability, high solder joint strength, high reliability, solderability in air and nitrogen protection.

Suntai offers a number of solder pastes for lead-free assembly, including no-clean, water washable and RMA formulations in jars, syringes and cartridges.

Suntai's lead-free solder paste are used for high-reliability, compatibility and sustainability applications, such as electronic assembly and semiconductor packaging In various industries including transportation, aerospace, consumer, defense, lighting and medical products.

Suntai's low-temperature solder paste designed for temperature sensitive applications. The most commonly used low-temperature solder paste is tin and bismuth-based. The advantage of this alloy is that it allows for the lowest soldering temperature. Low melting or low-Tg flex circuitry which are used in LED modules, smartwatches, heat sink and internet-of-things (IoT) devices.

Providing an alternative to traditional lead-free options. Suntai offers is continuously developing novel low-temperature lead-free solutions. The low-temperature lead-free solder paste has the advantages of fine solderability, wettability, high solder joint strength, high reliability, solderability in air and nitrogen protection.

Suntai offers a number of SnPb solder pastes for electronic assembly, including no-clean, water washable and RMA formulations in jars, syringes and cartridges. The tin-lead solder paste has flux and activator properties that give this paste excellent activity, long stencil life and long tack time.

Today, there are only a very few exceptions in which lead-containing solder pastes may be used. Exempt are, for example, safety-relevant components in the automotive, aviation, military, and medical engineering industries.

Suntai’s silver sintering pastes offer a robust lead-free alternative to solder pastes will bond strongly to die attach with Au, Ag, or Cu surfaces and increasing the lifetime of the device up to 10 times. Silver sintering pastes are high metal-loading materials, higher power densities come along with a higher operation temperature.

Silver sintering pastes offer a high melting temperature and fatigue resistance. Improved thermal conductivity and reduced electrical resistivity of the connecting material. Silver sintering pastes are available for the usage in semiconductor applications. These come as dispense process or print and offer high thermal conductivity for lead frame and LED Packaging.

Suntai high melting point (HMP) solder wire is designed for components which has high temperature, such as power semiconductor oil and gas exploration, require solder alloys that have the durability to withstand the extreme thermal. Geological and mechanical stresses of these applications.

Suntai understands system reliability is of the most importance with its fast wetting and low spattering to provide superior wetting performance for hand soldering in the electronics industry. When soldering with a laser or soldering robot, high temperatures are often used in order to achieve a fast cycle time.

The fluxes in Suntai’s unique lead-free cored solder wire products have been formulated to accommodate a wide variety of different alloys, cores, and diameters. The most importance with its fast wetting and low spattering to provide superior wetting performance for soldering in the electronics industry.

Suntai offers solid and cored solder, wire is available in a wide selection. When soldering with a laser or soldering robot, are used in order to achieve a fast cycle time. Solder wire is suitable for all electronic applications including consumer, automotive, aviation, LED, military and medical industries.

The fluxes in Suntai’s unique leaded cored solder wire products have been formulated to accommodate a wide variety of different alloys, cores, and diameters. The most importance with its fast wetting and low spattering to provide superior wetting performance for soldering in the electronics industry.

Suntai offers solid and cored solder wire is available in a wide selection. When soldering with a laser or soldering robot, are used in order to achieve a fast cycle time. Solder wire is suitable for all electronic applications including consumer, automotive, aviation, LED, military and medical industries.

Suntai’s lead-free bar solder is processed from high-quality, virgin metals in a proprietary method that removes contaminants and reduces dissolved oxides. We manufacture high quality, very low oxide content, extruded bar solder for wave, fountain, and dip soldering applications.

Suntai’s bar solder is manufactured from high purity conflict-free metals that meet and exceed ASTM B32, IPC J-STD-006, and JIS Z 3282 requirements. Our bar solder comes in all standard alloys and also can be custom ordered in non-standard alloys.

Suntai’s tin-lead bar solder is processed from high-quality, virgin metals in a proprietary method that removes contaminants and reduces dissolved oxides. We manufacture high quality, very low oxide content, extruded bar solder for wave, fountain, and dip soldering applications.

Suntai’s bar solder is manufactured from high purity conflict-free metals that meet exceed ASTM B32, IPC J-STD-006, and JIS Z 3282 requirements. Our bar solder comes in all standard alloys and also can be custom ordered in non-standard alloys.

Solvent based cleaners and water-based cleaners from Suntai cover virtually every cleaning requirement for electronics assembly and maintenance. Suntai cleaner is not ozone depleting and is environmentally friendly. Our cleaner is a halogen-free product developed for cleaning applications brings added value to electronic assemblies in high reliability markets.

Suntai’s line of industrial cleaners are suited for various applications across the electronics, automotive, aerospace, medical, electrical, defense, construction, shipbuilding and semiconductor manufacturing.

Solvent based cleaners and water-based cleaners from Suntai cover virtually every cleaning requirement for electronics assembly and maintenance. Suntai cleaner is not ozone depleting and is environmentally friendly. Our cleaner is a halogen-free product developed for cleaning applications brings added value to electronic assemblies in high reliability markets.

Suntai’s line of industrial cleaners are suited for various applications. Across the electronics, automotive, aerospace, medical, electrical, defense, construction, shipbuilding and semiconductor manufacturing.

Suntai’s wide selection of fluxes are available in no-clean RMA and water-soluble. Formulations engineered to facilitate Pb-free and SnPb wave soldering processes, selective soldering, rework operations, and laser soldering. Provide exceptional soldering performance to fulfill demanding a low solid, halide-free, no-clean flux assembly requirement.

Suntai’s liquid flux products are environmentally responsible and align with sustainable manufacturing approaches. The fluxes are suitable for various applications across the electronics, automotive, aerospace, medical, electrical, defense, construction, shipbuilding and semiconductor manufacturing.

• Suntai ST-903 flux Thinner is a solvent that used for reducing solids or replacing evaporated solvent, resulting in maximum efficiency of the flux.
• Suntai ST-903 flux thinner is used to thin no-clean, RMA and water soluble fluxes in foaming and some spray applications.
• Suntai ST-904 inkjet thinner is used to dilute and blend various pigments to make black pigments blacker and color pigments brighter, resulting in maximum efficiency of the ink.
• Suntai ST-905 conformal coating thinner is a high purity solvent blend designed for use with promotes good flow properties and suppresses blushing.
• Suntai ST-905 conformal coating thinner can also be used as a cleaner on metal equipment found in the conformal coating process including spray guns and dip coating machinery.

Suntai’s paste flux is available in no-clean, water soluble, and rosin based chemistries. The flux provides fast widespread wetting during soldering and leaves non-conductive and non-tacky residues.

Suntai’s paste flux is for use in rework applications, general touch up, rework of PCBs, BGA rework and ball sphere attachment applications. The paste flux also leaves a protective coating over the soldered area that can prevent corrosion.

Suntai is the premier provider of high-quality solder spheres for the electronics assembly and semiconductor packaging industries. We offer a very wide variety of alloys and size range capabilities, depending on the alloy and guarantees quick delivery.

Suntai's solder spheres are high-reliability, compatibility and sustainability. Used for semiconductor mounting, BGA Packaging repair and rework applications, such as electronic assembly and semiconductor packaging. In various industries including transportation, aerospace, consumer, and medical products.

Suntai offers high-quality solder ribbon and solder foil in pure metals, specialty alloys, standard tin-lead alloys, as well as a broad range of lead-free alloys. Common materials include tin, gold, silver, copper, bismuth and indium. Lead-free alloys possess higher melting points. Different alloys will require the use of compatible fluxes during the soldering process.

Solder Ribbon is supplied in continuous lengths and is packaging on spools. Solder Foil is supplied in sheet form. Solder ribbon is a type of solder that can be cut into desired shapes and lengths just before installation. It is available in many standard alloys and sizes.

Suntai offers high-quality solder ribbon and solder foil in pure metals, specialty alloys, standard tin-lead alloys, as well as a broad range of lead-free alloys. Common materials include tin, gold, silver, copper, bismuth and indium. Lead-free alloys possess higher melting points. Different alloys will require the use of compatible fluxes during the soldering process.

Solder Ribbon is supplied in continuous lengths and is packaging on spools. Solder Foil is supplied in sheet form. Solder ribbon is a type of solder that can be cut into desired shapes and lengths just before installation. It is available in many standard alloys and sizes.

Suntai offers high-quality solder preforms in pure metals, specialty alloys, standard tin-lead alloys, as well as a broad range of lead-free alloys. Common materials include tin, gold, silver, copper, bismuth and indium. Different alloys will require the use of compatible fluxes during the soldering process.

Suntai’s solder preforms provide a precise volume of solder for each solder joint that is uniform over high volumes. Solder preforms come in standard shapes such as squares, rectangles, washers, and discs. The main applications include, but are not limited to, die attach, PCB solder fortifications, connector pins, thermal fuses, and component attach.